SM2337 Datasheet, Microsemi Corporation

Available in axial leaded package Ultra Fast Recovery Time High Voltage Metallurgical bonding Voidless hermetically sealed glass package TX, TXV and space level screening.

BENEFITS APPLICATIONS/BENEFIT S
* TWT design
* Reverse Recovery less than 20 nano seconds.
* Cj less than 20.

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* High Voltage, Low Leakage, Ultra Fast Rectifier IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com KEY FEATURES Available in axial leaded package Ultra Fast Recovery Time.